bonding (active-passive) - TCP packets received out of order
This document (000020345) is provided subject to the disclaimer at the end of this document.
Environment
Intel® Ethernet 700 Series Network Adapter
Situation
It is also observed that the system generates TCP SACK to the sender which in return throttles the speed.
This is causing low throughput leading to performance problems.
The problem is not observed when a single network interface (NIC) instead of bonding is used.
The ethtool output for the single network interface shows:
# ethtool -i eth0
driver: i40e
version: 2.8.20-k
....
Resolution
# ethtool -set-priv-flags <interface name> disable-fw-lldp on
Cause
The firmware on the NIC cards is performing LLDP itself and interfering with what packets the kernel/driver sees.
The failure to forward the packets on to the network stack causes problems for the bond driver.
Per note from the hardware vendor:
"LACP may not function correctly in certain environments that require LLDP frames containing LCAP information to be forwarded to the network stack.".
Disclaimer
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- Document ID:000020345
- Creation Date: 22-Jul-2021
- Modified Date:26-Jul-2021
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- SUSE Linux Enterprise Server
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