The Call for Presentations for the Open Infrastructure Summit in Shanghai is now open, closing on July 2nd. This is the first time that the Open Infrastructure community has descended en masse upon mainland China, so this is an exciting milestone for Open Infrastructure.
At the recent Summit in Denver, we saw presentations given by community members from around the globe – sharing their stories, presenting alongside others working for competing organisations to share knowledge and find solutions to problems. As Jonathan Bryce’s keynote put it – collaborating without borders.
Collaborating across languages and technologies
There is an option to present in either English or Chinese at the Shanghai Summit, so this represents a fantastic opportunity for everyone to share their stories with the community, to network and to make new friends while reacquainting yourself with old friends.
Remember – the Summit is not just about OpenStack now, so if you’re willing and able to talk about Airship, Ansible, Ceph, Docker, Kata Containers, Kubernetes, ONAP, OpenStack, Open vSwitch, OPNFV, StarlingX, Zuul or similar technologies, get your thinking hat on now. These are the summit tracks:
- Container Infrastructure
- Hands-On Workshops
- AI, Machine Learning, HPC
- Private and Hybrid Cloud
- Public Cloud
- 5G, NFV and Edge
- Open Development
- Getting Started
Have you solved a problem for one of your customers recently and think that this is something worth sharing with others in the community? Do you have a customer with an unusual or interesting use case for any of these technologies? Have you fixed a bug, started an SIG, encountered an interesting bit of code that you’ve done something cool with, or something completely different?
If you can answer yes to one of these questions, or have just thought of something that you think has to be shared with the Open Infrastructure community, then what are you waiting for? There’s less than a month left, so submit your proposal for a presentation, and we’ll hopefully see you in Shanghai.